Cover Image

Materials for Advanced Packaging

This second edition continues to be the most comprehensive review on the developments in advanced electronic packaging technologies, with a focus on materials and processing. Recognized experts in the field contribute to 22 updated and new chapters that provide comprehensive coverage on various 3D p...

Full description

Corporate Author: SpringerLink (Online service)
Other Authors: Lu, Daniel. (Editor, http://id.loc.gov/vocabulary/relators/edt), Wong, C.P. (Editor, http://id.loc.gov/vocabulary/relators/edt)
Language:English
Published: Cham : Springer International Publishing : Imprint: Springer, 2017.
Edition:2nd ed. 2017.
Subjects:
Electronics.
Microelectronics.
Nanotechnology.
Metals.
Optical materials.
Electronic materials.
Electronic circuits.
Electronics and Microelectronics, Instrumentation.
Nanotechnology and Microengineering.
Metallic Materials.
Optical and Electronic Materials.
Circuits and Systems.
Online Access:https://doi.org/10.1007/978-3-319-45098-8

Internet

https://doi.org/10.1007/978-3-319-45098-8

Similar Items