Materials for Advanced Packaging
This second edition continues to be the most comprehensive review on the developments in advanced electronic packaging technologies, with a focus on materials and processing. Recognized experts in the field contribute to 22 updated and new chapters that provide comprehensive coverage on various 3D p...
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| Other Authors: | , |
| Language: | English |
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Cham :
Springer International Publishing : Imprint: Springer,
2017.
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| Edition: | 2nd ed. 2017. |
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| Online Access: | https://doi.org/10.1007/978-3-319-45098-8 |
Table of Contents:
- 3D Integration Technologies – An Overview
- Advanced Bonding/Joining Techniques
- Advanced Chip-to-Substrate Connections
- Advanced Wire Bonding Technology: Materials, Methods, and Testing
- Lead-Free Soldering
- Thin Die Fabrication and Applications to Wafer Level System Integration
- Advanced Substrates: A Materials and Processing Perspective
- Flip-Chip Underfill: Materials, Process and Reliability
- New Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips
- Electrically Conductive Adhesives (ECAs)
- Die Attach Adhesives and Films
- Thermal Interface Materials
- Embedded Passives
- Advanced Bonding Technology Based on Nano- and Micro-metal Pastes
- Wafer Level Chip Scale Packaging
- MEMS Packaging
- LED Die Bonding
- Medical Electronics Design, Manufacturing, and Reliability
- Flexible and Printed Electronics
- Silicon Solar Cell Metallization Pastes
- Nano-metal Assisted Chemical Etching for Fabricating Semiconductor and Optoelectronic Devices
- Characterization of Copper Diffusion in Through Silicon Vias.