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Advanced Flip Chip Packaging

Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for f...

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Corporate Author: SpringerLink (Online service)
Other Authors: Tong, Ho-Ming. (Editor, http://id.loc.gov/vocabulary/relators/edt), Lai, Yi-Shao. (Editor, http://id.loc.gov/vocabulary/relators/edt), Wong, C.P. (Editor, http://id.loc.gov/vocabulary/relators/edt)
Language:English
Published: New York, NY : Springer US : Imprint: Springer, 2013.
Edition:1st ed. 2013.
Subjects:
Electronics.
Microelectronics.
Electronic circuits.
Optical materials.
Electronic materials.
Electronics and Microelectronics, Instrumentation.
Circuits and Systems.
Optical and Electronic Materials.
Online Access:https://doi.org/10.1007/978-1-4419-5768-9

Internet

https://doi.org/10.1007/978-1-4419-5768-9

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