Materials for Advanced Packaging
This second edition continues to be the most comprehensive review on the developments in advanced electronic packaging technologies, with a focus on materials and processing. Recognized experts in the field contribute to 22 updated and new chapters that provide comprehensive coverage on various 3D p...
| Corporate Author: | |
|---|---|
| Other Authors: | , |
| Language: | English |
| Published: |
Cham :
Springer International Publishing : Imprint: Springer,
2017.
|
| Edition: | 2nd ed. 2017. |
| Subjects: | |
| Online Access: | https://doi.org/10.1007/978-3-319-45098-8 |