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Integrated Circuit Packaging, Assembly and Interconnections

Integrated Circuit Packaging, Assembly and Interconnections is intended as a multi-purpose text, serving individuals looking for an introduction, or a review, or an update of the various IC packaging, assembly, and interconnection technologies. To this end, it provides an overview of the materials a...

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Main Author: Greig, William. (Author, http://id.loc.gov/vocabulary/relators/aut)
Corporate Author: SpringerLink (Online service)
Language:English
Published: New York, NY : Springer US : Imprint: Springer, 2007.
Edition:1st ed. 2007.
Subjects:
Electronics.
Microelectronics.
Electronic circuits.
Engineering design.
Optical materials.
Electronic materials.
Electronics and Microelectronics, Instrumentation.
Circuits and Systems.
Engineering Design.
Optical and Electronic Materials.
Online Access:https://doi.org/10.1007/0-387-33913-2
Table of Contents:
  • Electronic Manufacturing and the Integrated Circuit
  • Integrated Circuit Manufacturing: A Technology Resource
  • Packaging the IC—Single Chip Packaging
  • The Chip Scale Package
  • Multichip Packaging
  • Known Good Die (KGD)
  • Packaging Options—Chip on Board
  • Chip & Wire Assembly
  • Tape Automated Bonding—TAB
  • Flip Chip—The Bumping Processes
  • Flip Chip Assembly
  • HDI Substrate Manufacturing Technologies: Thin Film Technology
  • HDI Substrate Manufacturing Technologies: Thick Film Technology
  • HDI Substrate Manufacturing Technologies: Cofired Ceramic
  • Substrate Manufacturing Technologies: Organic Packages and Interconnect Substrate.

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