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Integrated Circuit Packaging, Assembly and Interconnections

Integrated Circuit Packaging, Assembly and Interconnections is intended as a multi-purpose text, serving individuals looking for an introduction, or a review, or an update of the various IC packaging, assembly, and interconnection technologies. To this end, it provides an overview of the materials a...

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Main Author: Greig, William. (Author, http://id.loc.gov/vocabulary/relators/aut)
Corporate Author: SpringerLink (Online service)
Language:English
Published: New York, NY : Springer US : Imprint: Springer, 2007.
Edition:1st ed. 2007.
Subjects:
Electronics.
Microelectronics.
Electronic circuits.
Engineering design.
Optical materials.
Electronic materials.
Electronics and Microelectronics, Instrumentation.
Circuits and Systems.
Engineering Design.
Optical and Electronic Materials.
Online Access:https://doi.org/10.1007/0-387-33913-2

Internet

https://doi.org/10.1007/0-387-33913-2

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