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| LEADER |
00763cam a2200205 7i4500 |
| 001 |
0000033943 |
| 005 |
20040324090000.0 |
| 020 |
# |
0 |
|a 0792376765
|
| 090 |
0 |
0 |
|a TK 7870.15
|b F663
|
| 245 |
0 |
0 |
|a Foldable flex and thinned silicon multichip packaging technology
|c edited by John W. Balde..
|
| 260 |
# |
# |
|a Boston:
|b Kluwer Academic Publishers,
|c 2003.
|
| 300 |
# |
# |
|a xix, 338 p.:
|b ill.;
|c 25 cm..
|
| 490 |
0 |
0 |
|a Emerging technology in advanced packaging series ; 1
|
| 504 |
0 |
0 |
|a Includes bibliographical references and index
|
| 650 |
0 |
0 |
|a Microelectronic packaging
|
| 650 |
0 |
0 |
|a Chip scale packaging
|
| 650 |
0 |
0 |
|a Flexible printed circuits
|
| 650 |
0 |
0 |
|a Multichip modules (Microelectronics
|
| 700 |
1 |
1 |
|a Balde,
|h John W.
|
| 999 |
|
|
|a 1100022189
|b Book
|c Open Shelf
|e KOLEKSI TERBUKA
|
