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Power electronic packaging :
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Power electronic packaging : design, assembly process, reliability and modeling
Main Author:
Liu,Yong
Language:
English
Published:
New York:
Springer,
2012.
Subjects:
Electronic packaging
Power electronics
Holdings
Description
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KOLEKSI TERBUKA
Call Number:
TK 7870.15 .L5 2012
Accession
Item Category
Format
Status
Notes
1100085990
Open Shelf
Book
AVAILABLE
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