Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces

This thesis presents a series of mechanical test methods and comprehensively investigates the deformation and damage behavior of Cu/Pb-free solder joints under different loading conditions. The fracture behavior of Pb-free joint interfaces induced by stress, deformation of solder and substrate are s...

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Main Author: Zhang, Qingke. (Author, http://id.loc.gov/vocabulary/relators/aut)
Corporate Author: SpringerLink (Online service)
Language:English
Published: Berlin, Heidelberg : Springer Berlin Heidelberg : Imprint: Springer, 2016.
Edition:1st ed. 2016.
Series:Springer Theses, Recognizing Outstanding Ph.D. Research,
Subjects:
Online Access:https://doi.org/10.1007/978-3-662-48823-2