Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces
This thesis presents a series of mechanical test methods and comprehensively investigates the deformation and damage behavior of Cu/Pb-free solder joints under different loading conditions. The fracture behavior of Pb-free joint interfaces induced by stress, deformation of solder and substrate are s...
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| Language: | English |
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Berlin, Heidelberg :
Springer Berlin Heidelberg : Imprint: Springer,
2016.
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| Edition: | 1st ed. 2016. |
| Series: | Springer Theses, Recognizing Outstanding Ph.D. Research,
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| Online Access: | https://doi.org/10.1007/978-3-662-48823-2 |