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Design of Adhesive Joints Under Humid Conditions

This book describes most recent advances and limitations concerning design of adhesive joints under humid conditions and discusses future trends. It  presents new approaches to predict the failure load after exposure to load, temperature and humidity over a long period of time. With the rapid increa...

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Corporate Author: SpringerLink (Online service)
Other Authors: da Silva, Lucas F. M. (Editor, http://id.loc.gov/vocabulary/relators/edt), Sato, Chiaki. (Editor, http://id.loc.gov/vocabulary/relators/edt)
Language:English
Published: Berlin, Heidelberg : Springer Berlin Heidelberg : Imprint: Springer, 2013.
Edition:1st ed. 2013.
Series:Advanced Structured Materials, 25
Subjects:
Materials—Surfaces.
Thin films.
Mechanics.
Mechanics, Applied.
Polymers  .
Aerospace engineering.
Astronautics.
Surfaces and Interfaces, Thin Films.
Solid Mechanics.
Polymer Sciences.
Aerospace Technology and Astronautics.
Online Access:https://doi.org/10.1007/978-3-642-37614-6

Internet

https://doi.org/10.1007/978-3-642-37614-6

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