Electromigration Modeling at Circuit Layout Level

Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels.  Electromigration (EM) of interconnects has...

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Main Authors: Tan, Cher Ming. (Author, http://id.loc.gov/vocabulary/relators/aut), He, Feifei. (http://id.loc.gov/vocabulary/relators/aut)
Corporate Author: SpringerLink (Online service)
Language:English
Published: Singapore : Springer Singapore : Imprint: Springer, 2013.
Edition:1st ed. 2013.
Series:SpringerBriefs in Reliability,
Subjects:
Online Access:https://doi.org/10.1007/978-981-4451-21-5