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Arbitrary Modeling of TSVs for 3D Integrated Circuits

This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance, and nearby contact effects.  Readers will benefit from in-depth...

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Main Authors: Salah, Khaled. (Author, http://id.loc.gov/vocabulary/relators/aut), Ismail, Yehea. (http://id.loc.gov/vocabulary/relators/aut), El-Rouby, Alaa. (http://id.loc.gov/vocabulary/relators/aut)
Corporate Author: SpringerLink (Online service)
Language:English
Published: Cham : Springer International Publishing : Imprint: Springer, 2015.
Edition:1st ed. 2015.
Series:Analog Circuits and Signal Processing,
Subjects:
Electronic circuits.
Electronics.
Microelectronics.
Microprocessors.
Circuits and Systems.
Electronics and Microelectronics, Instrumentation.
Processor Architectures.
Online Access:https://doi.org/10.1007/978-3-319-07611-9

Internet

https://doi.org/10.1007/978-3-319-07611-9

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