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03886nam a22005895i 4500 |
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978-0-387-68422-2 |
| 003 |
DE-He213 |
| 005 |
20210615201242.0 |
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cr nn 008mamaa |
| 008 |
100301s2007 xxu| s |||| 0|eng d |
| 020 |
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|a 9780387684222
|9 978-0-387-68422-2
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| 024 |
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|a 10.1007/978-0-387-68422-2
|2 doi
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|a TK7800-8360
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|a 621.381
|2 23
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|a Lead-Free Soldering
|h [electronic resource] /
|c edited by Jasbir Bath.
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|a 1st ed. 2007.
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|a New York, NY :
|b Springer US :
|b Imprint: Springer,
|c 2007.
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| 300 |
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|a XIV, 299 p.
|b online resource.
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|a text
|b txt
|2 rdacontent
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|a computer
|b c
|2 rdamedia
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|a online resource
|b cr
|2 rdacarrier
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|a text file
|b PDF
|2 rda
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|a Lead Restrictions and Other Regulatory Influences on the Electronics Industry -- Fundamental Properties of Pb-Free Solder Alloys -- Lead-Free Surface Mount Assembly -- Lead-Free Wave Soldering -- Lead-Free Rework -- Lead-Free Solder Joint Reliability -- Backward and Forward Compatibility -- PCB Laminates -- Lead-Free Board Surface Finishes -- Lead-Free Soldering Standards.
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|a The push toward lead-free soldering in computers, cell phones and other electronic and electrical devices has taken on a greater urgency as laws have been passed or are pending in the United States, the European Union and Asia which ban lead-bearing solder. These new restrictions on hazardous substances are changing the way electronic devices are assembled, and specifically affect process engineering, manufacturing and quality assurance. Lead-Free Soldering offers in a single volume a broad collection of practical techniques for lead-free soldering design and manufacture, which up to now have been scattered in difficult-to-find scholarly sources. The book includes the latest information on proposed changes to lead-free standards, and up-to-date analysis of government and legislative activities and regulations in North America, Europe and Asia. Written by recognized experts in both academia and industry, Lead-Free Soldering is a must-have guide for practicing engineers interested in the latest developments surrounding areas such as lead-free alloy properties, reflow, wave, rework , solder joint reliability, PCB laminates and surface finishes, and backward and forward compatibility.
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|a Electronics.
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|a Microelectronics.
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|a Metals.
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|a Electronic circuits.
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|a Optical materials.
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|a Electronic materials.
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|a Environmental law.
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|a Environmental policy.
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|a Electronics and Microelectronics, Instrumentation.
|0 https://scigraph.springernature.com/ontologies/product-market-codes/T24027
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|a Metallic Materials.
|0 https://scigraph.springernature.com/ontologies/product-market-codes/Z16000
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|a Circuits and Systems.
|0 https://scigraph.springernature.com/ontologies/product-market-codes/T24068
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| 650 |
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|a Optical and Electronic Materials.
|0 https://scigraph.springernature.com/ontologies/product-market-codes/Z12000
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| 650 |
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|a Environmental Law/Policy/Ecojustice.
|0 https://scigraph.springernature.com/ontologies/product-market-codes/U16002
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| 700 |
1 |
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|a Bath, Jasbir.
|e editor.
|4 edt
|4 http://id.loc.gov/vocabulary/relators/edt
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| 710 |
2 |
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|a SpringerLink (Online service)
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| 773 |
0 |
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|t Springer Nature eBook
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| 776 |
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|i Printed edition:
|z 9781441940834
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| 776 |
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|i Printed edition:
|z 9780387512310
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| 776 |
0 |
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|i Printed edition:
|z 9780387324661
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| 856 |
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|u https://doi.org/10.1007/978-0-387-68422-2
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| 912 |
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|a ZDB-2-ENG
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| 912 |
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|a ZDB-2-SXE
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|a Engineering (SpringerNature-11647)
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| 950 |
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|a Engineering (R0) (SpringerNature-43712)
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